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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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STM32F427AI 数据表(PDF) 216 Page - STMicroelectronics |
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STM32F427AI 数据表(HTML) 216 Page - STMicroelectronics |
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216 / 240 page  Package information STM32F427xx STM32F429xx 216/240 DS9405 Rev 12 7.7 UFBGA169 package information (A0YV) This UFBGA is a 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package. Figure 89. UFBGA169 - Outline 1. Drawing is not to scale. 2. Primary datum C is defined by the plane established by the contact points of three or more solder balls that support the device when it is placed on top of a planar surface. 3. The terminal (ball) A1 corner must be identified on the top surface of the package by using a corner chamfer, ink or metallized markings, or other feature of package body or integral heat slug. A distinguish feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. A0YV_UFBGA169_ME_V2 E TOP VIEW A1 ball pad corner A SIDE VIEW Detail A C e N BOTTOM VIEW Ø b (169 balls) B eee Ø M fff Ø M C C A D1 E1 1 SE e 23 13 456 789 10 11 12 A1 ball pad corner M L K J H G F E D C B A SD B A D aaa C (4x) Seating plane A1 A3 C ddd Substrate Solder balls A5 A2 Mold resin C ccc 2 (DATUM B) (DATUM A) 3 DETAIL A C |
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