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STM32F427AI 数据表(PDF) 220 Page - STMicroelectronics |
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STM32F427AI 数据表(HTML) 220 Page - STMicroelectronics |
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220 / 240 page  Package information STM32F427xx STM32F429xx 220/240 DS9405 Rev 12 Figure 92. UFBGA(176+25) - Footprint example eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 120. UFBGA(176+25) - Example of PCB design rules (0.65 mm pitch BGA) Dimension Values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 119. UFBGA(176+25) - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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