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STM32F427AI 数据表(PDF) 217 Page - STMicroelectronics

部件名 STM32F427AI
功能描述  32b Arm® Cortex®-M4 MCUFPU, 225DMIPS, up to 2MB Flash/2564KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 com. interfaces, camera & LCD-TFT
PDF  240 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F427AI 数据表(HTML) 217 Page - STMicroelectronics

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STM32F427xx STM32F429xx
Package information
231
Table 117. UFBGA169 - Mechanical data
Symbol
millimeters
inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min.
Typ.
Max.
Min.
Typ.
Max.
A(2)
2. The profile height, A, is the distance from the seating plane to the highest point on the package. It is
measured perpendicular to the seating plane.
-
-
0.60
-
-
0.0236
A1(3)
3. A1 is defined as the distance from the seating plane to the lowest point on the package body.
0.05
-
-
0.0020
-
-
A2
-
0.43
-
-
0.0169
-
b(4)
4. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to primary
datum C.
0.23
0.28
0.33
0.0091
0.0110
0.0130
D(5)
5. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For
tolerances refer to form and position table.
7.00 BSC
0.2756 BSC
D1(5)
6.00 BSC
0.2362 BSC
E(5)
7.00 BSC
0.2756 BSC
E1(5)
6.00 BSC
0.2362 BSC
e(5)(6)
6. e represents the solder ball grid pitch.
0.50 BSC
0.0197 BSC
N(7)
7. N represents the total number of balls on the BGA.
169
SD(5)(8)
8. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the position of the
centre ball(s) in the outer row or column of a fully populated matrix.
0.50 BSC
0.0197 BSC
SE(5)(8)
0.50 BSC
0.0197 BSC
aaa(9)
9. Tolerance of form and position drawing
0.15
0.0059
ccc(9)
0.20
0.0079
ddd(9)
0.08
0.0031
eee(9)
0.15
0.0059
fff(9)
0.05
0.0020



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