1–18

Chapter 1: DC and Switching Characteristics of HardCopy III Devices

Switching Characteristics

HardCopy III Device Handbook, Volume 3

© December 2008

Altera Corporation

External Memory Interface Specifications

Table 1–25 through Table 1–30 list the external memory interface specifications for the

HardCopy III device family. Use these tables to perform memory interface timing

analysis.

Table 1–24. DPA Lock Time Specifications – Preliminary

(Note 1)

Standard

Training Pattern

Transition Density

Min

Typ

Max

Unit

SPI-4

00000000001111111111

10%

TBD

—

—

Number of repetitions

Parallel Rapid I/O

00001111

25%

TBD

—

—

Number of repetitions

10010000

50%

TBD

—

—

Number of repetitions

Miscellaneous

10101010

100%

TBD

—

—

Number of repetitions

01010101

100%

TBD

—

—

Number of repetitions

Note to Table 1–24:

(1) Pending silicon characterization.

Table 1–25. HardCopy III Maximum Clock Rate Support for External Memory Interfaces with

Half-Rate Controller – Preliminary (Note 1)

Memory Standards

(MHz)

Top and Bottom I/O Banks

Left and Right I/O Banks

DDR3 SDRAM

TBD

TBD

DDR2 SDRAM

TBD

TBD

DDR SDRAM

TBD

TBD

QDRII+ SRAM

TBD

TBD

QDRII SRAM

TBD

TBD

RLDRAM II

TBD

TBD

Note to Table 1–25:

(1) Pending silicon characterization.

Table 1–26. HardCopy III Maximum Clock Rate Support for External Memory Interfaces with

Full-Rate Controller – Preliminary

(Note 1)

Memory Standards

(MHz)

Top and Bottom I/O Banks

Left and Right I/O Banks

DDR2 SDRAM

TBD

TBD

DDR SDRAM

TBD

TBD

Note to Table 1–26:

(1) Pending silicon characterization.