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MPC8379ECVRALDA 数据表(PDF) 77 Page - Freescale Semiconductor, Inc

部件名 MPC8379ECVRALDA
功能描述  PowerQUICC??II Pro Processor Hardware Specifications
PDF  114 Pages
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

MPC8379ECVRALDA 数据表(HTML) 77 Page - Freescale Semiconductor, Inc

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MPC8379E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
77
Package and Pin Listings
20.3
SerDes Transmitter and Receiver Reference Circuits
Figure 59 shows the reference circuits for SerDes data lane’s transmitter and receiver.
Figure 59. SerDes Transmitter and Receiver Reference Circuits
The DC and AC specification of SerDes data lanes are defined in each interface protocol section below in
this document based on the application usage:
•
Section 8, “Ethernet: Enhanced Three-Speed Ethernet (eTSEC)”
•
Section 15, “Serial ATA (SATA)”
Note that an external AC coupling capacitor is required for the above three serial transmission protocols
with the capacitor value defined in specification of each protocol section.
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
21.1
Package Parameters for the MPC8379E TePBGA II
The package parameters are provided in the following list. The package type is 31 mm
× 31 mm,
689 plastic ball grid array (TePBGA II).
Package outline
31 mm
× 31 mm
Interconnects
689
Pitch
1.00 mm
Module height (typical)
2.0 mm to 2.46 mm (maximum)
Solder Balls
3.5% Ag, 96.5% Sn
Ball diameter (typical)
0.60 mm
50
Ω
50
Ω
Receiver
Transmitter
SD1_TX
n or
SD2_TX
n
SD1_TX
n or
SD2_TX
n
SD1_RX
n or
SD2_RX
n
SD1_RX
n or
SD2_RX
n
50
Ω
50
Ω



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