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STM8L101F2P3ATR 数据表(PDF) 67 Page - STMicroelectronics |
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STM8L101F2P3ATR 数据表(HTML) 67 Page - STMicroelectronics |
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67 / 81 page ![]() STM8L101xx Package characteristics Doc ID 15275 Rev 11 67/81 10.2 Package mechanical data Figure 37. UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package outline (5x5)(1)(2)(3) Figure 38. UFQFPN32 recommended footprint(1)(4) 1. Drawing is not to scale. 2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back- side pad to PCB ground. 4. Dimensions are in millimeters. Seating plane ddd C C A3 A1 A D e 9 16 17 24 32 Pin # 1 ID R = 0.30 8 E L L D2 1 b E2 A0B8_ME Bottom view Table 39. UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5), package mechanical data Dim. mm inches(1) Min Typ Max Min Typ Max A 0.5 0.55 0.6 0.0197 0.0217 0.0236 A1 0.00 0.02 0.05 0 0.0008 0.0020 A3 0.152 0.006 b 0.18 0.23 0.28 0.0071 0.0091 0.0110 D 4.90 5.00 5.10 0.1929 0.1969 0.2008 D2 3.50 0.1378 E 4.90 5.00 5.10 0.1929 0.1969 0.2008 E2 3.40 3.50 3.60 0.1339 0.1378 0.1417 e 0.500 0.0197 |
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