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STM8L101F2P3ATR 数据表(PDF) 79 Page - STMicroelectronics |
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STM8L101F2P3ATR 数据表(HTML) 79 Page - STMicroelectronics |
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79 / 81 page ![]() STM8L101xx Revision history Doc ID 15275 Rev 11 79/81 29-Nov-2009 8 Modified status of the document (datasheet instead of preliminary data) Replaced WFQFPN32 with UFQFPN32 and WFQFPN28 with UFQFPN28. Modified title of the reference manual mentioned in Section 2: Description on page 7 Added references to “low-density” in Section 2: Description on page 7, Section 3.5: Memory on page 11 and in Figure 8: Memory map on page 23 Modified Figure 8: Memory map on page 23 (unique ID are added) Table 7: General hardware register map on page 25: Modified reserved areas and IR block replaced with IRTIM block Modified tTEMP in Table 17: Operating conditions at power-up / power-down on page 41 Modified Table 23: LSI oscillator characteristics on page 47 Modified Table 25: Flash program memory on page 49 (tPROG) Modified Table 16: General operating conditions on page 40 and Table 38: Thermal characteristics on page 65 Modified Section 10: Package characteristics on page 66 18-Jun-2010 9 Modified Introduction and Description Modified one reserved area (0x00 5055 to 0x00 509F) in Table 7: General hardware register map on page 25 ModifiedTable 4: STM8L101xx pin description on page 20: modified note 2 and removed “wpu” for PC0 and PC1 Removed one note to Table 22: HSI oscillator characteristics on page 46 Modified first paragraph in Section : NRST pin on page 55 Modified OPT3 description in Table 11: Option byte description on page 34 Added note 5 to Table 18: Total current consumption in Run mode on page 42 Modified VESD(CDM) in Table 36: ESD absolute maximum ratings on page 63 Modified Figure 36: Typical application with I2C bus and timing diagram 1) on page 61 Modified COMP_REF availability information in Figure 47: STM8L101xx ordering information scheme on page 73 Modified Section 12.2: Software tools on page 75 Table 44. Document revision history (continued) Date Revision Changes |
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