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MPC5601DXLL 数据表(PDF) 44 Page - Freescale Semiconductor, Inc |
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MPC5601DXLL 数据表(HTML) 44 Page - Freescale Semiconductor, Inc |
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44 / 77 page ![]() MPC5602D Microcontroller Data Sheet, Rev. 3.1 Preliminary—Subject to Change Without Notice Electrical characteristics Freescale Semiconductor 44 4.12.1 Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user apply EMC software optimization and prequalification tests in relation with the EMC level requested for his application. • Software recommendations The software flowchart must include the management of runaway conditions such as: — Corrupted program counter — Unexpected reset — Critical data corruption (control registers...) • Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the reset pin or the oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring. 4.12.2 Electromagnetic interference (EMI) The product is monitored in terms of emission based on a typical application. This emission test conforms to the IEC 61967-1 standard, which specifies the general conditions for EMI measurements. 4.12.3 Absolute maximum ratings (electrical sensitivity) Based on two different tests (ESD and LU) using specific measurement methods, the product is stressed in order to determine its performance in terms of electrical sensitivity. 4.12.3.1 Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts * (n + 1) supply pin). This test conforms to the AEC-Q100-002/-003/-011 standard. Table 29. EMI radiated emission measurement1,2 1 EMI testing and I/O port waveforms per IEC 61967-1, -2, -4 2 For information on conducted emission and susceptibility measurement (norm IEC 61967-4), please contact your local marketing representative. Symbol C Parameter Conditions Value Unit Min Typ Max — SR — Scan range — 0.150 — 1000 MHz fCPU SR — Operating frequency — — 48 — MHz VDD_LV SR — LV operating voltages — — 1.28 — V SEMI CC T Peak level VDD = 5 V, TA =25°C, 100 LQFP package Test conforming to IEC 61967-2, fOSC = 8 MHz/fCPU = 48 MHz No PLL frequency modulation —— TBD dBµV ± 2% PLL frequency modulation —— TBD3 3 All values need to be confirmed during device validation dBµV |
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