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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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LSM303DLM 数据表(PDF) 16 Page - STMicroelectronics |
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LSM303DLM 数据表(HTML) 16 Page - STMicroelectronics |
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16 / 38 page  Application hints LSM303DLM 16/38 Doc ID 018725 Rev 1 6.2 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave “pin 1 indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com. 6.3 High current wiring effects High current in the wiring and printed circuit traces can be the cause of errors in magnetic field measurements for compassing. Conductor-generated magnetic fields add to the Earth’s magnetic field, creating errors in compass heading computation. Keep currents that are higher than 10 mA a few millimeters further away from the sensor IC. |
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