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LSM303DLM 数据表(PDF) 36 Page - STMicroelectronics |
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LSM303DLM 数据表(HTML) 36 Page - STMicroelectronics |
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36 / 38 page ![]() Package information LSM303DLM 36/38 Doc ID 018725 Rev 1 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions, and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 5. LGA-28: mechanical data and package dimensions Dimensions Ref. mm Min. Typ. Max. A1 1 A2 0.785 A3 0.200 D1 4.850 5.000 5.150 E1 4.850 5.000 5.150 L1 1.650 L2 3.300 N1 0.550 M 0.040 0.100 0.160 T1 0.260 0.300 0.340 T2 0.360 0.400 0.440 d 0.200 k 0.050 h 0.100 LGA-28 (5x5x1) Land Grid Array Packages Outline and 8192208_B mechanical data |
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