BFS520 datasheet(70/130 Pages) NXP

70 / 130 page

NXP Semiconductors RF Manual 16th edition

2.6.2

CompletingNXP'sRFpowertransistoroffering:productsinplasticpackages(OMP)

NXP is currently developing a complete line of overmolded plastic (OMP) RF power

transistors and MMICs with peak powers ranging from 3 to 500 W. The main benefit of

plastic packages is cost effectiveness with little or no impact on performance. The range

of plastic devices will complement the extensive range of RF power products that NXP

offers in ceramic packages for all frequency ranges and applications up to 2.45 GHz.

Products in development

` Single-stage broadband drivers in HSOP-outlines, from

3 to 10 W

` Single-stage OMP drivers from 25 to 45 W, replacing

their ceramic equivalents for cost-sensitive applications

` Dual-stage MMICs from 30 to 60 W that can be used as

high-gain drivers or combined as low-power dual-stage

Doherty amplifiers

` Fully integrated plug-and-play Doherty PAs in a single

package (50 to 100 W)

` Final transistors in OMP package (SOT502-sized) ranging

from 140 to 200 W in frequency bands from 730 MHz

to 2.2 GHz

` Final transistors in OMP package (SOT502-sized) ranging

from 3 to 500 W in ISM frequency bands from a few MHz

up to 2.45 GHz

Some of these products are available for sampling now, while

the rest of the portfolio will be rolled out throughout 2012.

Type

min

(MHz)

max

(MHz)

P1dB

(W)

Matching Package

Description

BLP7G22-10

700

2200

SOT1179

Gen7 OMP LDMOS transistor for WCDMA & GSM applications

BLM7G22S-60PB(G)

2000

2200

I/O

SOT1212

Gen7 LDMOS MMIC for WCDMA applications (gull-wing)

BLP7G07S-140P(G)

700

900

140

SOT1224

Gen7 OMP push-pull LDMOS transistor for GSM, WCDMA & LTE applications (gull-wing)

BLP7G09S-140P(G)

900

1000

140

SOT1224

Gen7 OMP push-pull LDMOS transistor for GSM, WCDMA & LTE applications (gull-wing)

RF power products in plastic packages (OMP)

BFS520 数据表(PDF) 70 Page - NXP Semiconductors

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