SL40307A-R19KHF datasheet(48/53 Pages) IRF

48 / 53 page

IR3846

48 www.irf.com

August 01, 2013

SOLDER RESIST



IR recommends that the larger Power or Land

Area pads are Solder Mask Defined (SMD).

This allows the underlying Copper traces to be

as large as possible, which helps in terms of

current carrying capability and device cooling

capability.



When using SMD pads, the underlying copper

traces should be at least 0.05mm larger (on

each edge) than the Solder Mask window, in

order to accommodate any layer to layer

misalignment. (i.e. 0.1mm in X & Y).



However, for the smaller Signal type leads

around the edge of the device, IR recommends

that these are Non Solder Mask Defined or

Copper Defined.



When using NSMD pads, the Solder Resist

Window should be larger than the Copper Pad

by at least 0.025mm on each edge, (i.e.

0.05mm in X & Y), in order to accommodate any

layer to layer misalignment.



Ensure that the solder resist in-between the

smaller signal lead areas are at least 0.15mm

wide, due to the high x/y aspect ratio of the

solder mask strip.

PAD SIZES

PAD SPACING

SL40307A-R19KHF 数据表(PDF) 48 Page - International Rectifier

SL40307A-R19KHF 数据表(HTML) 48 Page - International Rectifier

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