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CF745 数据表(PDF) 200 Page - Microchip Technology

部件名 CF745
功能描述  EPROM/ROM-Based 8-Bit CMOS Microcontroller Series
PDF  217 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

CF745 数据表(HTML) 200 Page - Microchip Technology

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PIC16C5X
DS30453B-page 200
Preliminary
© 1998 Microchip Technology Inc.
Package Type:
K04-072 20-Lead Plastic Shrink Small Outine (SS) – 5.30 mm
MIN
p
Pitch
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Radius Centerline
Gull Wing Radius
Shoulder Radius
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Lead Thickness
Foot Angle
Foot Length
Standoff
Number of Pins
β
α
c
φ
A2
A1
A
n
E1
B†
L1
R2
L
R1
E‡
D‡
Dimension Limits
Units
0.65
0.026
8
0
0
5
510
10
0.012
0.007
0.005
0.020
0.005
0.005
0.306
0.208
0.283
0.005
0.036
0.073
20
0.301
0
0.010
0.005
0.000
0.015
0.005
0.005
0.205
0.278
0.002
0.026
0.068
0.311
0.015
0.009
0.010
0.025
0.010
0.010
48
0.212
0.289
0.008
0.046
0.078
0
05
510
10
7.65
0.25
0.13
0.00
0.38
0.13
0.13
0
5.20
7.07
0.05
0.66
1.73
7.90
7.78
4
0.32
0.18
0.13
0.13
0.51
0.13
0.38
0.22
0.25
0.25
0.64
0.25
5.29
7.20
0.13
20
1.86
0.91
5.38
7.33
0.21
1.99
1.17
NOM
INCHES
MAX
NOM
MILLIMETERS*
MIN
MAX
n
1
2
R1
R2
D
p
B
E1
E
L1
L
c
β
φ
α
A1
A
A2
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”



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