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CF745 数据表(PDF) 201 Page - Microchip Technology

部件名 CF745
功能描述  EPROM/ROM-Based 8-Bit CMOS Microcontroller Series
PDF  217 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

CF745 数据表(HTML) 201 Page - Microchip Technology

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© 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 201
PIC16C5X
Package Type:
K04-073 28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm
Dimension Limits
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Lead Thickness
Radius Centerline
Gull Wing Radius
Shoulder Radius
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Number of Pins
Foot Angle
Foot Length
Standoff
Pitch
β
α
B†
E‡
L
c
L1
φ
R1
R2
E1
A2
D‡
A1
A
n
p
Units
MAX
NOM
MIN
MAX
NOM
MIN
10
10
0.38
0.22
0.25
0.64
0.25
0.25
7.90
5.38
10.33
0.21
1.17
1.99
0.012
0
0.010
0
5
5
10
0.015
10
0.007
0.005
0.020
0.005
0.005
0.306
0.208
0.402
0.005
0.036
0.073
0.026
0.205
0.015
0.005
0.000
0
0.005
0.005
0.301
0.396
0.002
0.026
0.068
0.212
4
0.025
0.009
0.010
8
0.010
0.010
0.311
28
0.407
0.008
0.046
0.078
0.25
0
0
5
0.32
5
5.20
0.13
0.00
0.38
0.13
0.13
7.65
0
10.07
0.05
0.66
1.73
5.29
0.51
0.18
0.13
4
0.13
0.13
7.78
10.20
0.13
0.91
1.86
0.65
28
8
INCHES
MILLIMETERS*
n
1
2
R1
R2
D
p
B
E
E1
L
L1
β
c
φ
α
A1
A2
A
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”



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