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CF745 数据表(PDF) 205 Page - Microchip Technology |
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CF745 数据表(HTML) 205 Page - Microchip Technology |
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205 / 217 page ![]() © 1998 Microchip Technology Inc. Preliminary DS30453B-page 205 PIC16C5X MMMMMMMM MMMMMMMM AABBCDE 18-Lead CERDIP Windowed 28-Lead CERDIP Windowed 9801 CBA Example Example PIC16C54 /JW MMMMMMMMMMMMMM AABBCDE 28-Lead CERDIP Skinny Windowed PIC16C57 /JW 9838 CCT Example Legend: MM...M Microchip part number information XX...X Customer specific information* AA Year code (last 2 digits of calendar year) BB Week code (week of January 1 is week ‘01’) C Facility code of the plant at which wafer is manufactured O = Outside Vendor C = 5” Line S = 6” Line H = 8” Line D Mask revision number E Assembly code of the plant or country of origin in which part was assembled Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. MMMMMMMMMMMMMM MMMMMMMMMMM AABBCDE MMMMMMMMMMM PIC16C57 /JW 9838 CBA |
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