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AT89C51ED2-RDTIM 数据表(PDF) 11 Page - ATMEL Corporation |
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AT89C51ED2-RDTIM 数据表(HTML) 11 Page - ATMEL Corporation |
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11 / 24 page ![]() AT89C51RD2 / AT89C51ED2 QualPack Rev. 0 – 2003 July 11 4.3.2 Hot Carriers Injection Test conditions The test is performed by forcing a high drain bias on the test device (Vds>Vddmax) to accelerate the carriers to the maximum. At the same time the gate bias (Vgs) is chosen in order to maximize the injection of carriers into the gate oxide and also the substrate. WLR_B n-channel W/L 0.35um/25um the stress is performed on a number of transistors, each at a different stress condition Vds,stress and Vgs,stress. For each transistor, the time to reach the failure criteria (dIdsat/Idsat=10%) is obtained. NMOS is more sensitive to hot carriers compared to PMOS. Consequently NMOS is the only structure tested. Measurement AT568T7 lot 1J0433 has been measured using the WLR_B hot electron structure with standard drain. NMOS W/L = 25/0.35 um. Results HCI 56.8k 1J0433 AT568T7 FAB 5 N-Channel W/L 0.35/25.0um 10% Change in Idsat y = 5E+16x30,692 R2 = 0,9719 0,0001 0,001 0,01 0,1 1 0,2 0,22 0,24 0,26 0,28 0,3 1/Vdd Conclusion The extrapolated life time in the worst case conditions (@Vds=Vdd max & Vgs set to maximize substrate current) is much greater than 0.2 years in DC mode (qualification requirement) which is equivalent to more than 10 years in AC mode. |
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