AT89C51RD2 / AT89C51ED2 QualPack

Rev. 0 – 2003 July

7

4 Qualification

4.1 Qualification Methodology

All product qualifications are split into three distinct steps as shown below. Before a product is released for use,

successful qualification testing are required at wafer, device and package level.

- Wafer Level Reliability consists in testing individually basic process modules regarding their well known

potential limitations (Electro-migration, Hot Carriers Injection, Oxide Breakdown, NVM Data Retention).

Each test is performed using wafer process specific structures.

- Device reliability is covering either dice design and processing aspects. The tests are performed on device

under qualification, but generic data may also be considered for reliability calculation.

- For each package type proposed in the Datasheet, it is verified that qualification data are available. If not

qualification tests are carried out for the new package types. In addition, one package type is selected to

verify packaging reliability of the device under qualification.

Product

Qualification

Wafer Level

Reliability

Device

Reliability

Packaging

Reliability

(Design / Process)