AT89C51RD2 / AT89C51ED2 QualPack

Rev. 0 – 2003 July

21

4.5 AT89C51ED2 Packaging reliability

In this section are presented the packaging qualification measurements carried out in PLCC 44.

Lots

Device Type

Test Description

Step

Result Comment

A01948K

AT89C51ED2

PLCC 44

Humidity 85/85 post

Preconditioning level 1

500h

0/50

0/50

Thermal Cycles post

Preconditioning L1

500c

1000c

0/50

0/50

Autoclave post thermal

shocks and Precond. L1

96h

0/50

A01679C

AT89C51RC2

PLCC44

Preconditioning level 1

SAM

Visual

Elect.

0/11

0/50

0/50

Thermal Cycles post

Preconditioning L1

500c

1000c

0/50

0/50

Humidity 85/85 post

Preconditioning level 1

500h

0/50

0/50

Autoclave post thermal

shocks and Precond. L1

96h

0/50

High Temperature

Storage

500h

1000h

0/50

0/50

Marking permanency

Visual

0/5

4.6

AT89C51ED2 Qualification status

Atmel digital 0.35 um wafer process is qualified since 1999, October.

Derived from this technology, AT89C51RD2 / AT89C51ED2 have passed successfully Reliability Testing. Full

qualification has been pronounced in June 2003.

All package pass Level 1 of Moisture Sensitivity Ranking as per JESD 20B. Therefore, Dry Packing is not

mandatory.