AT89C51ED2-RDTIM datasheet(2/24 Pages) ATMEL

2 / 24 page

AT89C51RD2 / AT89C51ED2 QualPack

Rev. 0 – 2003 July

1 Table of contents

TABLE OF CONTENTS............................................................................................................................................. 2

GENERAL INFORMATION...................................................................................................................................... 3

TECHNOLOGY INFORMATION ............................................................................................................................ 4

3.1

WAFER PROCESS TECHNOLOGY .............................................................................................................................. 4

3.2

PRODUCT DESIGN................................................................................................................................................... 5

3.3

DEVICE CROSS SECTION .......................................................................................................................................... 6

QUALIFICATION ...................................................................................................................................................... 7

4.1

QUALIFICATION METHODOLOGY ............................................................................................................................ 7

4.2

QUALIFICATION TEST METHODS............................................................................................................................. 8

4.3

WAFER LEVEL RELIABILITY ................................................................................................................................... 9

4.3.1

Electromigration ............................................................................................................................................... 9

4.3.2

Hot Carriers Injection ..................................................................................................................................... 11

4.3.3

Time Dependent Dielectric Breakdown ............................................................................................................ 12

4.3.4

FLASH Characteristics.................................................................................................................................... 14

4.4

DEVICE RELIABILITY............................................................................................................................................ 18

4.4.1

Operating Life Testing..................................................................................................................................... 18

4.4.2

ESD / Latch-up................................................................................................................................................ 18

4.4.3

FLASH and EEPROM Data Retention and Endurance Cycling ........................................................................ 18

4.4.4

AT89C51ED2 Operating Reliability Calculation.............................................................................................. 20

4.5

AT89C51ED2 PACKAGING RELIABILITY............................................................................................................... 21

4.6

AT89C51ED2 QUALIFICATION STATUS ................................................................................................................ 21

ENVIRONMENTAL INFORMATION .................................................................................................................... 22

OTHER DATA .......................................................................................................................................................... 23

6.1

ISO / TS16949 : 2002 CERTIFICATE ..................................................................................................................... 23

6.2

DATA BOOK REFERENCE ...................................................................................................................................... 24

6.3

REVISION HISTORY .............................................................................................................................................. 24

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