MPC875 datasheet(9/84 Pages) FREESCALE

9 / 84 page

MPC875/MPC870 Hardware Specifications, Rev. 3.0

Freescale Semiconductor

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

Thermal Characteristics

Table 4 shows the thermal characteristics for the MPC875/870.

Power Dissipation

Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are

equal, and 2:1, where CPU frequency is twice bus speed.

Table 4. MPC875/870 Thermal Resistance Data

Rating

Environment

Symbol

Value

Unit

Junction-to-ambient 1

1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

Natural convection

Single-layer board (1s)

RθJA

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

°C/W

Four-layer board (2s2p)

RθJMA

3 Per JEDEC JESD51-6 with the board horizontal.

Airflow (200 ft/min)

Single-layer board (1s)

RθJMA

Four-layer board (2s2p)

RθJMA

Junction-to-board 4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

RθJB

Junction-to-case 5

5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed

pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated

value from the junction to the exposed pad without contact resistance.

RθJC

Junction-to-package top 6

6 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2.

Natural convection

ΨJT

Airflow (200 ft/min)

ΨJT

Table 5. Power Dissipation (PD)

Die Revision

Bus

Mode

Frequency

Typical 1

1 Typical power dissipation is measured at V

DDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V.

Maximum 2

Unit

1:1

66 MHz

310

390

80 MHz

350

430

2:1

133 MHz

430

495

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