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CS2000-CP 数据表(PDF) 35 Page - Cirrus Logic |
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CS2000-CP 数据表(HTML) 35 Page - Cirrus Logic |
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35 / 37 page ![]() CS2000-CP DS761F3 35 10.PACKAGE DIMENSIONS Notes: 1. Reference document: JEDEC MO-187 2. D does not include mold flash or protrusions which is 0.15 mm max. per side. 3. E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side. 4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max. 5. Exceptions to JEDEC dimension. THERMAL CHARACTERISTICS INCHES MILLIMETERS NOTE DIM MIN NOM MAX MIN NOM MAX A — — 0.0433 — — 1.10 A1 0 — 0.0059 0 — 0.15 A2 0.0295 — 0.0374 0.75 — 0.95 b 0.0059 — 0.0118 0.15 — 0.30 4, 5 c 0.0031 — 0.0091 0.08 — 0.23 D — 0.1181 BSC — — 3.00 BSC — 2 E — 0.1929 BSC — — 4.90 BSC — E1 — 0.1181 BSC — — 3.00 BSC — 3 e — 0.0197 BSC — — 0.50 BSC — L 0.0157 0.0236 0.0315 0.40 0.60 0.80 L1 — 0.0374 REF — — 0.95 REF — 0° -- 8° 0° — 8° Parameter Symbol Min Typ Max Units Junction to Ambient Thermal Impedance JEDEC 2-Layer JEDEC 4-Layer JA JA - - 170 100 - - °C/W °C/W Junction to Case Thermal Impedance JC -30.2 - °C/W Junction to Top Thermal Characteristic (Center of Package) ΨJT -6 - °C/W 10L MSOP (3 mm BODY) PACKAGE DRAWING (Note 1) E N 1 23 e b A1 A2 A D SEATING PLANE E1 L SIDE VIEW END VIEW TOP VIEW L1 c |
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