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ST7FOXU0 数据表(PDF) 121 Page - STMicroelectronics |
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ST7FOXU0 数据表(HTML) 121 Page - STMicroelectronics |
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121 / 123 page  ST7FOXU0 Package characteristics 121/123 14.2 Thermal characteristics Table 66. Thermal characteristics Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) SO8 130 °C/W DIP8 82 TJmax Maximum junction temperature(1) 1. The maximum chip-junction temperature is based on technology characteristics. 150 °C PDmax Power dissipation(2) 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. SO8 180 mW DIP8 300 |
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