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STM32F042F4 数据表(PDF) 109 Page - STMicroelectronics |
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STM32F042F4 数据表(HTML) 109 Page - STMicroelectronics |
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109 / 117 page  DocID025832 Rev 5 109/117 STM32F042x4 STM32F042x6 Package information 113 Figure 52. Recommended footprint for TSSOP20 package 1. Dimensions are expressed in millimeters. L1 - 1.000 - - 0.0394 - k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 73. TSSOP20 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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