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STM32F042F4 数据表(PDF) 111 Page - STMicroelectronics |
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STM32F042F4 数据表(HTML) 111 Page - STMicroelectronics |
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111 / 117 page  DocID025832 Rev 5 111/117 STM32F042x4 STM32F042x6 Package information 113 7.8 Thermal characteristics The maximum chip junction temperature (TJmax) must never exceed the values given in Table 21: General operating conditions . The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max x ΘJA) Where: • TA max is the maximum ambient temperature in °C, • ΘJA is the package junction-to-ambient thermal resistance, in °C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. 7.8.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org 7.8.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Section 8: Ordering information. Table 74. Package thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient LQFP48 - 7 mm x 7 mm 55 °C/W Thermal resistance junction-ambient UFQFPN48 - 7 mm x 7 mm 33 Thermal resistance junction-ambient WLCSP36 2.6 mm x 2.7 mm 64 Thermal resistance junction-ambient LQFP32 - 7 mm x 7 mm 57 Thermal resistance junction-ambient UFQFPN32 - 5 mm x 5 mm 38 Thermal resistance junction-ambient UFQFPN28 - 4 mm x 4 mm 118 Thermal resistance junction-ambient TSSOP20 - 6.5 mm x 6.4 mm 76 |
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