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NCV7728DPAR2G 数据表(PDF) 5 Page - ON Semiconductor

部件名 NCV7728DPAR2G
功能描述  Hex Half-Bridge Driver
PDF  27 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

NCV7728DPAR2G 数据表(HTML) 5 Page - ON Semiconductor

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MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Voltage (VS1, VS2)
(DC)
(AC), t < 500ms, Ivsx > −2A
VsxdcMax
VSXac
−0.3 to 40
−1.0
V
Output Pin OUTx
(DC)
(AC), t< 500ms, IOUTx > −1.1A
(AC), t< 500ms, IOUTx < 1A
VoutxDc
VoutxAc
−0.3 to 40
−1.0
1.0
V
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, VCC)
VioMax
−0.3 to 5.5
V
Output Current (OUT1, OUT2, OUT3, OUT4, OUT5, OUT6)
IoutxImax
−2.0 to 2.0
A
Electrostatic Discharge, Human Body Model, VSx, OUTx (AEC−Q100−002)
Vesd4k
4.0
kV
Electrostatic Discharge, Human Body Model, all other pins (AEC−Q100−002)
Vesd2k
2.0
kV
Electrostatic Discharge, Machine Model (AEC−Q100−003)
Vesd200
200
V
Short Circuit Reliability Characterization
AECQ10x
Grade A
Operating Junction Temperature
Tj
−40 to 150
°C
Storage Temperature Range
Tstr
−55 to 150
°C
Moisture Sensitivity Level (MAX 260
°C Processing)
MSL2
2
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL INFORMATION (Note 1)
Rating
Symbol
Value
Unit
Junction to Ambient
RqJA
96.4
°C/W
Junction to Lead
RyJL
63
°C/W
1. Thermal Information is based on having 3 high side and 3 low side devices dissipating 80 mW each on a 2 layer board 0.062
″ thick FR4 board
with 600 mm2 copper spreader area. 2 oz copper is used for the copper spreader area and the ambient temperature is specified at 25
°C.
RECOMMENDED OPERATING CONDITIONS
Rating
Symbol
Value
Unit
Min
Max
Digital Supply Input Voltage
VccOp
3.15
5.25
V
Battery Supply Input Voltage
VsxOp
5.5
28
V
DC Output Current
IxOp
0.55
A
Junction Temperature
TjOp
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.



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