ADAR2004ACCZ-R7 datasheet(7/37 Pages) AD

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Data Sheet

ADAR2004

Rev. 0 | Page 7 of 37

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VPOS1, VPOS2, VPOS4 to GND1

+3 V, −0.3 V

VPOS3 to GND1

+2 V, −0.3 V

Digital Input to GND1

2 V

RFINx±, LOIN to GND1

±0.3 V

RFINx± Power

20 dBm

LOIN Power

−5 dBm

Temperature

Operating Range

−40°C to +85°C

Storage Range

−65°C to +150°C

Junction

135°C

Reflow Soldering

Peak Temperature

260°C

GND is the common ground to which all GNDx pins are connected.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

CC-48-21

32.1

°C/W

Pad soldered.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADAR2004

Table 5. ADAR2004, 48-Terminal LGA

ESD Model

Withstand Threshold (V)

Class

HBM

1000 to 2000

CDM

1000 to 1250

ESD CAUTION

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