LTC4372/LTC4373

18

Rev. 0

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PACKAGE DESCRIPTION

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

0.40

±0.10

BOTTOM VIEW—EXPOSED PAD

1.65

±0.10

(2 SIDES)

0.75

±0.05

R = 0.125

TYP

2.38

±0.10

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD8) DFN 0509 REV C

0.25

±0.05

2.38

±0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

1.65

±0.05

(2 SIDES)

2.10

±0.05

0.50

BSC

0.70

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.25

±0.05

0.50 BSC

DD Package

8-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1698 Rev C)