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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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STM32F103CBU6TR 数据表(PDF) 83 Page - STMicroelectronics |
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STM32F103CBU6TR 数据表(HTML) 83 Page - STMicroelectronics |
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83 / 116 page  DS5319 Rev 18 83/116 STM32F103x8, STM32F103xB Package information 115 6.2 UFQFPN48 package information This UFQFPN is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 44. UFQFPN48 outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to the VSS or VDD power pads. It is recommended to connect it to VSS. 3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life. A0B9_ME_V3 D Pin 1 identifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T Table 52. UFQFPN48 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 D 6.900 7.000 7.100 0.2717 0.2756 0.2795 E 6.900 7.000 7.100 0.2717 0.2756 0.2795 D2 5.500 5.600 5.700 0.2165 0.2205 0.2244 E2 5.500 5.600 5.700 0.2165 0.2205 0.2244 |
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