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STM32F103CBU6TR 数据表(PDF) 93 Page - STMicroelectronics |
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STM32F103CBU6TR 数据表(HTML) 93 Page - STMicroelectronics |
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93 / 116 page ![]() DS5319 Rev 18 93/116 STM32F103x8, STM32F103xB Package information 115 Figure 54. UFBGA100 recommended footprint eee - - 0.150 - - 0.0059 fff - -- 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to four decimal digits. Table 57. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 56. UFBGA100 mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A0C2_FP_V1 Dpad Dsm |
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