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STM32F103CBU6TR 数据表(PDF) 87 Page - STMicroelectronics |
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STM32F103CBU6TR 数据表(HTML) 87 Page - STMicroelectronics |
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87 / 116 page ![]() DS5319 Rev 18 87/116 STM32F103x8, STM32F103xB Package information 115 Figure 48. LFBGA100 recommended footprint 1. Values in inches are converted from mm and rounded to four decimal digits. Table 54. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.500 mm Dsm 0.570 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.500 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm H0_FP_V1 Dpad Dsm |
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