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STM32F103CBU6TR 数据表(PDF) 98 Page - STMicroelectronics |
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STM32F103CBU6TR 数据表(HTML) 98 Page - STMicroelectronics |
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98 / 116 page ![]() Package information STM32F103x8, STM32F103xB 98/116 DS5319 Rev 18 6.7 TFBGA64 package information This TFBGA is a 64-ball, 5x5 mm, 0.5 mm pitch thin profile fine pitch ball grid array package. Figure 59. TFBGA64 outline 1. Drawing is not to scale. Table 59. TFBGA64 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A - - 1.200 - - 0.0472 A1 0.150 - - 0.0059 - - A2 - 0.200 - - 0.0079 - A4 - - 0.600 - - 0.0236 b 0.250 0.300 0.350 0.0098 0.0118 0.0138 D 4.850 5.000 5.150 0.1909 0.1969 0.2028 D1 - 3.500 - - 0.1378 - E 4.850 5.000 5.150 0.1909 0.1969 0.2028 E1 - 3.500 - - 0.1378 - e - 0.500 - - 0.0197 - F - 0.750 - - 0.0295 - ddd - - 0.080 - - 0.0031 R8_ME_V4 Seating plane A1 e F F D H Øb (64 balls) A E TOP VIEW BOTTOM VIEW 18 e A B A C ddd C D1 E1 eee C B A fff Ø Ø M M C A2 A4 A1 ball identifier A1 ball index area SIDE VIEW |
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