STM32U545NET3QTR datasheet(273/283 Pages) STMICROELECTRONICS

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DS14216 Rev 1

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STM32U545xx

Package information

279

Table 141. WLCSP72 - Mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

A(2)

2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal

and tolerances values of A1 and A2.

0.58

0.0228

0.17

0.0067

0.38

0.0150

A3(3)

3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process capability.

0.025

0.0010

b(4)

4. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.20

0.23

0.25

0.0079

0.0090

0.0098

3.36

3.38

3.40

0.1323

0.1330

0.1338

3.36

3.38

3.40

0.1323

0.1330

0.1338

0.35

0.0138

2.63

0.1035

2.42

0.0952

F(5)

5. Calculated dimensions are rounded to the 3rd decimal place.

0.378

0.0149

G(5)

0.478

0.0188

aaa

0.10

0.0039

ccc(6)

6. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of

the pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc

perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The

axis perpendicular to datum Z of each ball must lie within this tolerance zone.

0.10

0.0039

ddd(7)

7. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone ddd perpendicular to datum Z and located on true

position as defined by e. The axis perpendicular to datum Z of each ball must lie within this tolerance zone.

Each tolerance zone ddd in the array is contained entirely in the respective zone ccc above. The axis of

each ball must lie simultaneously in both tolerance zones.

0.10

0.0039

eee

0,05

0.0020

fff

0.05

0.0020

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