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BLUENRG-332VC 数据表(PDF) 55 Page - STMicroelectronics |
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BLUENRG-332VC 数据表(HTML) 55 Page - STMicroelectronics |
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55 / 67 page ![]() 7.2 WLCSP36 package information (01C1) This WLCSP is a 36-ball, 2.652 x 2.592 mm, 0.40 mm pitch, wafer level chip scale array package. Figure 20. WLCSP36 - Outline C b fD e E1 fH fE e D1 fG 1 2 3 4 5 6 7 A B C D E F G H J K L M A1 ball (1) BOTTOM VIEW A1 A3 A2 A ccc C SIDE VIEW E TOP VIEW 1. The terminal A1 on the bumps side is identified by a distinguishing feature (for instance by a circular "clear area" - typically 0.1 mm diameter) and/or a missing bump. The terminal A1 on the backside of the product is identified by a distinguishing feature (for instance by a circular "clear area" - typically 0.5 mm diameter). 2. Drawing is not to scale. BlueNRG-LPS WLCSP36 package information (01C1) DS13819 - Rev 4 page 55/67 |
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