9

Suggested footprint

The MASTERGAN1 footprint for the PCB layout is usually defined based on several design factors such as

assembly plant technology capabilities and board component density. For easy device usage and evaluation, ST

provides the following footprint design, which is suitable for the largest variety of PCBs.

The following footprint indicates the copper area which should be free from the solder mask, while the copper

area shall extend beyond the indicated areas especially for EP2 and EP3. To aid thermal dissipation, it is

recommended to add thermal vias under these EPADs to transfer and dissipate device heat to the other PCB

copper layers. A PCB layout example is available with the MASTERGAN1 evaluation board.

Figure 22. Suggested footprint (top view drawing)

TOP VIEW

Dimensions in mm

MASTERGAN1

Suggested footprint

DS13417 - Rev 3

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