72

73

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

647 SERIES

657 SERIES

HIGH-PERFORMANCE HEAT SINKS FOR VERTICAL

BOARD MOUNTING

657 SERIES

HIGH-PERFORMANCE HEAT SINKS FOR VERTICAL

BOARD MOUNTING

HIGH-PERFORMANCE NOTCHED HEAT SINKS

FOR VERTICAL BOARD MOUNTING

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

647 SERIES

(EXTRUSION PROFILE 5195)

Height Above

Standard

PC Board “A”

Maximum Footprint

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

647-1OABEP

1.000 (25.4)

1.650 (41.9) x 1.000 (25.4)

42°C @ 6W

3.8°C/W @ 200 LFM

0.055 (24.95)

647-15ABEP

1.500 (38.1)

1.650 (41.9) x 1.000 (25.4)

37°C @ 6W

3.5°C/W @ 200 LFM

0.075 (34.02)

647-175ABEP

1.750 (44.5)

1.650 (41.9) x 1.000 (25.4)

34°C @ 6W

3.3°C/W @ 200 LFM

0.090 (40.82)

647-20ABEP

2.000 (50.8)

1.650 (41.9) x 1.000 (25.4)

31°C @ 6W

3.1°C/W @ 200 LFM

0.104 (47.17)

647-25ABEP

2.500 (63.5)

1.650 (41.9) x 1.000 (25.4)

25°C @ 6W

2.8°C/W @ 200 LFM

0.125 (56.70)

Material: Aluminum, Black Anodized

Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit boards. Maximum

semiconductor package width: 0.625 (15.9). Refer to the Accessory Products section for thermal interface materials,

126 Series silicone-free thermal compounds, and other accessories products.

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

Thermal Performance at Typical Load

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

Height Above

Maximum

Standard

PC Board “A”

Footprint

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs (grams)

657-10ABEP

1.000 (25.4)

1.650 (41.9) x 1.000 (25.4)

41°C @ 6W

3.7°C/W @ 200 LFM

0.0515 (23.36)

657-15ABEP

1.500 (38.1)

1.650 (41.9) x 1.000 (25.4)

38°C @ 6W

3.3°C/W @ 200 LFM

0.0760 (34.60)

657-20ABEP

2.000 (50.8)

1.650 (41.9) x 1.000 (25.4)

32°C @ 6W

2.9°C/W @ 200 LFM

0.1030 (47.00)

657-25ABEP

2.500 (63.5)

1.650 (41.9) x 1.000 (25.4)

25°C @ 6W

2.7°C/W @ 200 LFM

0.1250 (57.00)

Wave-solderable pins. Material: Aluminum, Black Anodized

Thermal Performance at Typical Load

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

657 SERIES

(EXTRUSION

PROFILE 6533)

Height Above

Maximum

Standard

PC Board “A”

Footprint

Natural

Forced

P/N

in. (mm)

in. (mm)

Convection

Convection

657-10ABEPN

1.000 (25.4)

1.650 (41.9) x 1.000 (25.4)

41°C @ 6W

3.7°C/W @ 200 LFM

657-15ABEPN

1.500 (38.1)

1.650 (41.9) x 1.000 (25.4)

38°C @ 6W

3.3°C/W @ 200 LFM

657-20ABEPN

2.000 (50.8)

1.650 (41.9) x 1.000 (25.4)

32°C @ 6W

2.9°C/W @ 200 LFM

657-25ABEPN

2.500 (63.5)

1.650 (41.9) x 1.000 (25.4)

25°C @ 6W

2.7°C/W @ 200 LFM

Wave-solderable pins. Material: Aluminum, Black Anodized

Thermal Performance at Typical Load

MECHANICAL DIMENSIONS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

Dimensions: in. (mm)

657 SERIES

HIGH-PERFORMANCE HEAT SINKS WITH SPEEDCLIPS™

FOR VERTICAL BOARD MOUNTING

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

657 SERIES

(EXTRUSION PROFILE 6533)

Height Above

Maximum

Standard

PC Board “A”

Footprint

Natural

Forced

P/N

in. (mm)

in. (mm)

Convection

Convection

657-10ABEPSC

1.000 (25.4)

1.650 (41.9) x 1.000 (25.4)

41°C @ 6W

3.7°C/W @ 200 LFM

657-15ABEPSC

1.500 (38.1)

1.650 (41.9) x 1.000 (25.4)

38°C @ 6W

3.3°C/W @ 200 LFM

657-20ABEPSC

2.000 (50.8)

1.650 (41.9) x 1.000 (25.4)

32°C @ 6W

2.9°C/W @ 200 LFM

657-25ABEPSC

2.500 (63.5)

1.650 (41.9) x 1.000 (25.4)

25°C @ 6W

2.7°C/W @ 200 LFM

Wave-solderable pins. Material: Aluminum, Black Anodized

Thermal Performance at Typical Load

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

TO-220

TO-218; TO-247; TO-220

TO-218; TO-247; TO-220

TO-218; TO-247; TO-220

657 SERIES

(EXTRUSION

PROFILE 6533)