68

69

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

260 SERIES

260 SERIES

EPOXY INSULATED FOR TO-5

Base Mounting Configurations — TO-5

Plain Type — Epoxy bonded, or used with #4 pan head screws.

Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care

should be taken not to use too long a screw, which could short against

the semiconductor case. For correct screw lengths:

Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness

Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud

hole must be slightly countersunk to ensure flat mounting.

To determine the correct mounting screw lengths, add dimensions as follows:

Correct Screw Length (L) =

Depth of Base + Panel Thickness + Washer Thickness

Thread

Size:

4 = #4-40 UNC

Base Style: H = hex

6 = #6-32 UNC

Semiconductor

Mounting T = tapped

Case Style: 5 = TO-5

Style:

S = stud

Insulation E = epoxy

P = plain

Characteristics

TO-5

Thermal Resistance – Epoxy Insulated

14° C/W

Breakdown Voltage – Epoxy Type (VAC), 60 Hz

500

Recommended Operating Voltage, AC or DC

Clean Conditions: % Hipot Rating

50

Dusty Conditions: % Hipot Rating

30

Dirty Conditions: % Hipot Rating

10 to 20

Temperature Range — Continuous (C°)

-73/+149

Depth of

Model

Tapped Base

260-4T5E

0.093 (2.36)

260-4TH5E

0.125 (3.18)

Outline Dimension

Standard

Insulation

L x W x I.D.

Weight

Case

P/N

Type

in. (mm)

lbs. (grams)

Style

260-4T5E

Epoxy Insulated

0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)

0.0024 (1.09)

TO-5

260-4TH5E

Epoxy Insulated

0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)

0.0031 (1.41)

TO-5

260-6SH5E

Epoxy Insulated

0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)

0.0037 (1.68)

TO-5

Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”

CUP CLIPS FOR TO-5 CASE STYLE SEMICONDUCTORS

TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE

260-4T5E

260-4TH5E

260-6SH5E

258 SERIES

THERMAL LINKS FOR FUSED GLASS DIODES

Standard

Dimensions

Weight

P/N

in. (mm)

Material

Finish

lbs. (grams)

258

0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6)

Aluminum

DeltaCoate™ 151 on all surfaces

0.0018 (0.82)

except solder pads and base

The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120

Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the

diode leads to ambient is reduced from about 150°C/watt to 22°C/watt.

MECHANICAL DIMENSIONS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

634 SERIES

Height Above

Footprint

PC Board

Dimensions

Weight

Plain Pin

Without Pin

in. (mm)

in. (mm)

lbs. (grams)

634-10ABEP

634-10AB

1.000 (25.4)

0.640 (16.26) x 0.640 (16.26)

0.016 (7.48)

634-15ABEP

634-15AB

1.500 (38.1)

0.640 (16.26) x 0.640 (16.26)

0.025 (11.21)

634-20ABEP

634-20AB

2.000 (50.8)

0.640 (16.26) x 0.640 (16.26)

0.033 (14.95)

Material: Aluminum, Black Anodized.

These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220

and TO-218 components. Models are available with or without wave-solderable pins on 0.40 in. (10.2) centers,

making them ideal for a variety of applications where quick assembly is needed and space is at a premium.

TYPICAL THERMAL PERFORMANCE

FOR 634-15ABP

SLIM PROFILE UNIDIRECTIONAL FIN VERTICAL

MOUNT HEAT SINK

Dimensions: in. (mm)

Standard P/N

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

TO-5

Diodes

TO-220 and TO-218

1. Thermal compound is

assumed between device

and heat sink.

2. Tab temp with longer

heat sink (634-20ABP)

will typically be about

15% cooler. Tab temp

with shorter heat sink

(634- I0ABP) will typically

be about 25% higher.

NOTES: