75

Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3

(one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any

mounting attitude will provide free circulation of air in natural convection applications. These

680 Series heat sinks

can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).

Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4

and DO-5 diodes, where close board-to-board spacing and efficient heat dissipation are required. The

601 and

603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary.

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

677 SERIES

680 SERIES

HIGH-PERFORMANCE, HIGH-POWER HEAT

SINKS FOR VERTICAL BOARD MOUNTING

690 SERIES

MAXIMUM EFFICIENCY OMNIDIRECTIONAL

HEAT SINKS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

677 SERIES

(EXTRUSION

PROFILE 8719)

Height Above

Maximum

Standard

PC Board “A”

Footprint

Natural

Forced

P/N

in. (mm)

in. (mm)

Convection

Convection

677-10ABEP

1.000 (25.4)

1.650 (41.9) x 1.000 (25.4)

52°C @ 6W

3.1°C/W @ 200 LFM

677-15ABEP

1.500 (38.1)

1.650 (41.9) x 1.000 (25.4)

46°C @ 6W

2.8°C/W @ 200 LFM

677-20ABEP

2.000 (50.8)

1.650 (41.9) x 1.000 (25.4)

40°C @ 6W

2.5°C/W @ 200 LFM

677-25ABEP

2.500 (63.5)

1.650 (41.9) x 1.000 (25.4)

35°C @ 6W

2.2°C/W @ 200 LFM

Wave-solderable pins. Material: Aluminum, Black Anodized

MECHANICAL DIMENSIONS

MECHANICAL DIMENSIONS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

Dimensions: in. (mm)

Dimensions: in. (mm)

Thermal Performance at Typical Load

Height Above

Semiconductor

Standard

PC Board

Outline Dimensions

Natural

Forced

Mounting

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

Hole Pattern

lbs. (grams)

690-3B

1.310 (33.3)

1.860 (47.2)-sq

44°C @ 7.5W

2.0°C/W @ 400 LFM

(1) TO-3

0.0700 (31.75)

690-66B

1.310 (33.3)

1.860 (47.2)-sq

44°C @ 7.5W

2.0°C/W @ 400 LFM

(1) TO-66

0.0700 (31.75)

690-220B

1.310 (33.3)

1.860 (47.2)-sq

44°C @ 7.5W

2.0°C/W @ 400 LFM

(2) TO-220

0.0700 (31.75)

Material: Aluminum, Black Anodized

These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three

standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package

TO-220 power semiconductor types. For higher power semiconductors, the

690 Series can dissipate up to 20

watts while maintaining a mounting surface temperature rise above ambient air temperature of no more

than 91°C.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR MOUNTING HOLES

TO-3

TO-66

*TWO TO-220’S

Thermal Performance at Typical Load

Height Above

Horizontal Mounting

Semiconductor

Standard

PC Board “A”

Footprint Dimensions

Natural

Forced

Mounting

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

Hole Pattern

lbs. (grams)

680-5A

0.500 (12.7)

1.810 (46.0)-sq

70°C @ 7.5W

3.0°C/W @ 400 LFM

(1) TO-3

0.0700 (31.75)

680-75A

0.750 (19.1)

1.810 (46.0)-sq

58°C @ 7.5W

2.4°C/W @ 400 LFM

(1) TO-3

0.0900 (40.82)

680-10A

1.000 (25.4)

1.810 (46.0)-sq

52°C @ 7.5W

2.0°C/W @ 400 LFM

(1) TO-3

0.0980 (44.45)

680-125A

1.250 (31.8)

1.810 (46.0)-sq

45°C @ 7.5W

1.5°C/W @ 400 LFM

(1) TO-3

0.1100 (49.90)

680-5220

0.500 (12.7)

1.810 (46.0)-sq

70°C @ 7.5W

3.0°C/W @ 400 LFM

(2) TO-220

0.0700 (31.75)

680-75220

0.750 (19.1)

1.810 (46.0)-sq

58°C @ 7.5W

2.4°C/W @ 400 LFM

(2) TO-220

0.0900 (40.82)

680-10220

1.000 (25.4)

1.810 (46.0)-sq

52°C @ 7.5W

2.0°C/W @ 400 LFM

(2) TO-220

0.0980 (44.45)

680-125220

1.250 (31.8)

1.810 (46.0)-sq

45°C @ 7.5W

1.5°C/W @ 400 LFM

(2) TO-220

0.1100 (49.90)

Material: Aluminum, Black Anodized

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR MOUNTING HOLES

TO-3

A

220

K

*TWO TO-220’S

Thermal Performance at Typical Load

601 & 603 SERIES

HIGHEST EFFICIENCY/LOWEST UNIT COST

HEAT SINKS

LOW-HEIGHT HEAT SINKS

Footprint

Mounting

Standard

Dimensions

Height

Hole Dia.

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

601E

2.000 (50.8) x 1.250 (31.8)

0.562 (14.3)

0.200 (5.1)

52°C @ 5.0W

4.5°C/W @ 175 LFM

0.0500 (22.68)

601F

2.000 (50.8) x 1.250 (31.8)

0.562 (14.3)

0.270 (6.9)

52°C @ 5.0W

4.5°C/W @ 175 LFM

0.0500 (22.68)

601K

2.000 (50.8) x 1.250 (31.8)

0.562 (14.3)

None

52°C @ 5.0W

4.5°C/W @ 175 LFM

0.0500 (22.68)

603K

2.000 (50.8) x 2.000 (50.8)

0.562 (14.3)

None

41°C @ 5.0W

4.0°C/W @ 175 LFM

0.0810 (36.74)

Material: Aluminum Alloy, Black Anodized

Thermal Performance at Typical Load

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

TO-3; TO-220

TO-218; TO-220; TO-247;

15-Lead Multiwatt

TO-3; TO-66; TO-220

DO-4/DO-5 Diodes

74