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281-2AB 数据表(PDF) 4 Page - List of Unclassifed Manufacturers

部件名 281-2AB
功能描述  BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
PDF  21 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  ETC [List of Unclassifed Manufacturers]
网页  
标志 ETC - List of Unclassifed Manufacturers

281-2AB 数据表(HTML) 4 Page - List of Unclassifed Manufacturers

  281-2AB Datasheet HTML 1Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 2Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 3Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 4Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 5Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 6Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 7Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 8Page - List of Unclassifed Manufacturers 281-2AB Datasheet HTML 9Page - List of Unclassifed Manufacturers Next Button
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wakefield-vette.com
Contact us: (603) 635-2800
BOARD LEVEL
HEAT SINKS
BOARD LEVEL
HEAT SINKS
VERTICAL MOUNT HEAT SINK
Height Above
Maximum
Standard
PC Board
Footprint
P/N
in. (mm)
in. (mm)
Natural Convection
Forced Convection
206-1PABEH
1.18 (30.0)
1.00 (25.4) x .50 (12.7)
56°C rise @ 4W
7.3°C/W @ 200LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
5
10
15
20
25
0200
400600
8001000
HEAT DISSIPATED (WATTS)
0.5
2.5
2.0
1.5
1.0
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
5
10
15
20
25
0200
400600
8001000
HEAT DISSIPATED (WATTS)
0.5
2.5
2.0
1.5
1.0
0
20
40
60
80
100
0200
400
600800
1000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400
600800
1000
HEAT DISSIPATED (WATTS)
1
5
4
3
2
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
12
14
16
18
20
0200
400600
8001000
HEAT DISSIPATED (WATTS)
1
5
4
3
2
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400600
8001000
HEAT DISSIPATED (WATTS)
2
10
8
6
4
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400600
8001000
HEAT DISSIPATED (WATTS)
2
10
8
6
4
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
230 SERIES
234 SERIES
230-75AB-05
230-75AB-10
230-75AB-01
234 SERIES
234-75AB
234-75AB-01
234-75AB-05
230 AND 234 SERIES
Dimensions: in. (mm)
COMPACT, WAVE-SOLDERABLE LOW-PROFILE
SELF-LOCKING HEAT SINKS
230 & 234 SERIES
262 SERIES
HORIZONTAL AND VERTICAL MOUNT HEAT SINK
Height Above
Maximum
Standard
PC Board
Footprint
P/N
in. (mm)
in. (mm)
Natural Convection
Forced Convection
262-75ABE-05
.53 (13.4)
.75 (19.1) x .50 (12.78)
80°C rise @ 2W
10°C/W @ 200LFM
262-75ABE-01
.75 (19.1)
.53 (13.4) x .50 (12.7)
80°C rise @ 2W
10°C/W @ 200LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
5
10
15
20
25
0200
400600
8001000
HEAT DISSIPATED (WATTS)
0.5
2.5
2.0
1.5
1.0
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
5
10
15
20
25
0200
400600
8001000
HEAT DISSIPATED (WATTS)
0.5
2.5
2.0
1.5
1.0
0
20
40
60
80
100
0200
400
600800
1000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400
600800
1000
HEAT DISSIPATED (WATTS)
1
5
4
3
2
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
12
14
16
18
20
0200
400600
8001000
HEAT DISSIPATED (WATTS)
1
5
4
3
2
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400600
8001000
HEAT DISSIPATED (WATTS)
2
10
8
6
4
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400600
8001000
HEAT DISSIPATED (WATTS)
2
10
8
6
4
206 SERIES
Thermal Performance at Typical Load
Height Above
Footprint
Solderable
Standard
PC Board
Dimensions
Mounting
Tab
Mounting
Natural
Forced
P/N
in. (mm)
in. (mm) Configuation Option
Style
Convection Convection
230-75AB
.750 (19.1)
.570 (14.5) x .500 (12.7) Vert./Horiz.
No Tab
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
230-75ABE-01
.750 (19.1)
.570 (14.5) x .500 (12.7)
Vertical
01
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
230-75ABE-05
.500 (12.7)
.750 (19.1) x .570 (14.5)
Horizontal
05
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
230-75ABE-10
.875 (22.2)
.570 (14.5) x .500 (12.7)
Vertical
10
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
234-75AB
.790 (20.0)
.570 (14.5) x .500 (12.7) Vert./Horiz
No Tab
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
234-75ABE-01
.790 (20.0)
.570 (14.5) x .500 (12.7)
Vertical
01
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
234-75ABE-05
.500 (12.7)
.790 (20.0) x .570 (14.5) Horizontal
05
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Material: Aluminum, Black Anodized
Thermal Performance at Typical Load
Thermal Performance at Typical Load
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
HORIZONTAL MOUNT HEAT SINK
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
5
10
15
20
25
0200
400600
8001000
HEAT DISSIPATED (WATTS)
0.5
2.5
2.0
1.5
1.0
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
5
10
15
20
25
0200
400600
8001000
HEAT DISSIPATED (WATTS)
0.5
2.5
2.0
1.5
1.0
0
20
40
60
80
100
0200
400
600800
1000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400
600800
1000
HEAT DISSIPATED (WATTS)
1
5
4
3
2
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
12
14
16
18
20
0200
400600
8001000
HEAT DISSIPATED (WATTS)
1
5
4
3
2
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400600
8001000
HEAT DISSIPATED (WATTS)
2
10
8
6
4
0
20
40
60
80
100
0200
400600
8001000
AIR VELOCITY (LFM)
0
2
4
6
8
10
0200
400600
8001000
HEAT DISSIPATED (WATTS)
2
10
8
6
4
Height Above
Maximum
Standard PC Board Footprint
P/N
in. (mm)
in. (mm)
Natural Convection
Forced Convection
241-69ABE-03
.39 (9.9)
.86 (21.8) x .69 (17.5)
77°C rise @ 4W
12°C/W @ 200LFM
Material: Aluminum, Black Anodized
241 SERIES
Thermal Performance at Typical Load
TO-220
TO-220
TO-220
TO-220



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