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wakefield-vette.com

Contact us: (603) 635-2800

04

8121620

0

200

400

600

800

1000

0

20

40

60

80

100

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1

2

3

4

5

AIR VELOCITY (FPM)

POWER DISSIPATION (WATTS)

667-10ABP

667-25ABP

7-2

5

P

Speed

Clip

330SC

4 lb

Nominal

Force

Installed

Speed

Clip

285SC

10 lb

Nominal

Force

Installed

0.093

(2.4) DIA

0.156

(4.0)

0.670

(17.0)

0.730

(18.5)

0.062

(1.6) REF

1.375

(34.9)REF

0.500

(12.7)REF

1.000

(25.4)

0.180

(4.6) DIA

0.093

(2.4)

(NOMINAL)

DIA

0.044 (1.1) (STANDOFF)

0.130 (3.3)

0.125 (3.2) DIA

RAISED BOSS x 0.030 (0.8) HIGH

A

Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with

the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices.

626 AND 627 SERIES

Height Above

Standard

PC Board “A”

Maximum Footprint

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

637-10ABEP

1.000 (25.4)

1.375 (34.9) x 0.500 (12.7)

76°C @ 6W

5.8°C/W @ 200 LFM

0.023 (10.43)

637-15ABEP

1.500 (38.1)

1.375 (34.9) x 0.500 (12.7)

65°C @ 6W

5.5°C/W @ 200 LFM

0.035 (15.88)

637-20ABEP

2.000 (50.8)

1.375 (34.9) x 0.500 (12.7)

55°C @ 6W

4.7°C/W @ 200 LFM

0.050 (22.68)

637-25ABEP

2.500 (63.5)

1.375 (34.9) x 0.500 (12.7)

48°C @ 6W

4.2°C/W @ 200 LFM

0.062 (28.12)

Material: Aluminum, Black Anodized

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

667 SERIES

637 SERIES

Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor

package width 0.625 in. (15.9). Use this heat sink where weight and board space occupied must be minimized.

Refer to the Accessory products section for thermal interface materials, thermal compounds, and other

accessories products.

637 SERIES

(EXTRUSION PROFILE 5183)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

MECHANICAL DIMENSIONS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

Dimensions: in. (mm)

HIGH-EFFICIENCY HEAT SINKS FOR VERTICAL

BOARD MOUNTING

626 & 627 SERIES

HIGH-EFFICIENCY HEAT SINKS FOR VERTICAL

BOARD MOUNTING

Thermal Performance at Typical Load

667 SERIES

(EXTRUSION PROFILE 8073)

STANDOFF

PINS

“SP”

PLAIN

PINS

“PP”

Height Above

Maximum

Standard P/N

PC Board “A”

Footprint

Natural

Forced

Weight

Standoff Pin Plain Pin

in. (mm) in. (mm) Convection Convection

lbs. (grams)

667-10ABESP

667-10ABPP

1.000 (25.4)

1.375 (34.9) x 0.500 (12.7)

76°C @ 6W

5.8°C/W @ 200 LFM

0.0240 (11.0)

667-15ABESP

667-15ABPP

1.500 (38.1)

1.375 (34.9) x 0.500 (12.7)

66°C @ 6W

5.5°C/W @ 200 LFM

0.0340 (15.6)

667-20ABESP

667-20ABPP

2.000 (50.8)

1.375 (34.9) x 0.500 (12.7)

58°C @ 6W

4.7°C/W @ 200 LFM

0.0460 (21.0)

667-25ABESP

667-25ABPP

2.500 (63.5)

1.375 (34.9) x 0.500 (12.7)

48°C @ 6W

4.2°C/W @ 200 LFM

0.0580 (26.2)

Order 330 SC or 285 SC SpeedClip™ separately.

Wave-solderable pins. Material: Aluminum, Black Anodized

Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff

pins (SP-Type), and reduced assembly cost.

LABOR-SAVING SPEEDCLIP™ HEAT SINKS FOR

VERTICAL BOARD MOUNTING

Dimensions: in. (mm)

POWER DISSIPATION (WATTS)

AIR VELOCITY (FPM)

0.156 (4.0)

0.093

(2.4)

0.130 (3.3)

DIA

MECHANICAL DIMENSIONS

Thermal Performance at Typical Load

0.044 (1.1) (STANDOFF)

Height Above

Maximum

Standard

Standard

PC Board “A”

Footprint

Natural

Forced

P/N

P/N

in. (mm)

in. (mm)

Convection

Convection

626-10ABEP

627-10ABP

1.000 (25.4)

1.375 (34.9) x .500 (12.7)

76°C @ 6W

5.8°C/W @ 200 LFM

626-15ABEP

627-15ABP

1.500 (38.1)

1.375 (34.9) x .500 (12.7)

65°C @ 6W

5.5°C/W @ 200 LFM

626-20ABEP

627-20ABP

2.000 (50.8)

1.375 (34.9) x .500 (12.7)

55°C @ 6W

4.7°C/W @ 200 LFM

626-25ABEP

627-25ABP

2.500 (63-5)

1.375 (34.9) x .500 (12.7)

48°C @ 6W

4.2°C/M @ 200 LFM

Wave-solderable pins. Material: Aluminum, Black Anodized

Thermal Performance at Typical Load

292 SERIES

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

Height Above

Overall

Standard

PC Board

Fin Width

Thermal Performance

Weight

P/N

in. (mm)

in. (mm)

Natural Convection

Finish

lbs. (grams)

292-AB

0.750 (19.1)

0. 600 (15.3)

0.225°C/W @ 0.250 W

Black Anodized

0.00049 (0.22)

Material: Aluminum, Black Anodized

HEAT SINK FOR SINGLE TO-92

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

Speed

Clip

330SC

Speed

Clip

285SC

10 lb

Nominal

Force

Installed

4lb

Nominal

Force

Installed

1.000

(25.4)

0.180

(4.6)

0.093

(2.4)

NOMINAL)

DIA

DIA

0.125 (3.2) DIA

RAISED BOSS x 0.030 (0.8) HIGH

0.670

(17.0)

04

8121

620

0

200

400

600

800

1000

0

20

40

60

80

100

0

1

2

3

4

5

AIRVELOCITY

(FPM)

POWERDISSIP

ATION

(WAT

TS)

667

-10

ABP

667

-25

ABP

7-2

5

P

Speed

Clip

330SC

4lb

Nominal

Force

Installed

Speed

Clip

285SC

10lb

Nominal

Force

Installed

0.093

(2.4)DI

A

0.156

(4.0)

0.670

(17.0)

0.730

(18.5)

0.062

(1.6)REF

1.375

(34.9)REF

0.500

(12.7)REF

1.000

(25.4)

0.180

(4.6)DIA

0.093

(2.4)

(NOMINAL)

DIA

0.044(1.1)

(STANDOFF)

0.130(3.3)

0.125(3.2)

DIA

RAISEDBOSS

x0.030

(0.8)HIGH

A

0.500

(12.7)

1.375

(34.9)

0.062

(1.6)

0.730

(18.5)

REF

REF

REF

TO-92

TO-220

TO-220

TO-220 and TO-218

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS