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wakefield-vette.com

Contact us: (603) 635-2800

TAPE DETAILS

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

REEL DETAILS

Height Off Base Power Dissipation @ Thermal Resistance Package

Part Number Description Attachment Length Width (Height Of Fin) Temperature Rise @ Forced Air Flow Type

219-263A

TO-263 SMD Solderable

0.500"

1.020"

0.480"

2W @ 30°C

8°C/W @ 500 LFM

Bulk

HEAT SINK

Feet

(12.70mm) (25.91mm)

(12.19mm)

ANODZD

MECHANICAL DIMENSIONS

TAPE AND REEL INFORMATION

Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors.

The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically

assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body

to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink

body by forging to reduce the interface thermal resistance between the drains & heat dissipation body.

• Increased thermal performance up to 30% over bright copper heat sinks from improved

radiation of the black finish.

• Increased surface areas by 3 times therefore thermal performance up to 300% over the

aluminum stamped heat sinks on markets.

• Light weight aluminum construction allows faster pick and place assembly reducing the

manufacturing cycle time.

• Radius mounted “Rollers” are designed for maximizing heat transfer from component and to

avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks.

• Available in bulk packaging or Tape & Reel.

FEATURES AND BENEFITS

219-263A HEAT SINK FOR TO-263 DEVICES

219 SERIES HEAT SINKS FOR TO-263 DEVICES

Height Off Base Power Dissipation @ Thermal Resistance Package

Part Number Description Attachment Length Width (Height Of Fin) Temperature Rise @ Forced Air Flow Type

219-263A-TR

TO-263 SMD Solderable

0.500"

1.020"

0.480"

2W @ 30°C

8°C/W @ 500 LFM

Tape & Reel

HEAT SINK

Feet

(12.70mm) (25.91mm)

(12.19mm)

ANODZD

Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors.

The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically

assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body

to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink

body by forging to reduce the interface thermal resistance between the drains & heat dissipation body.

• Increased thermal performance up to 30% over bright copper heat sinks from improved

radiation of the black finish.

• Increased surface areas by 3 times therefore thermal performance up to 300% over the

aluminum stamped heat sinks on markets.

• Light weight aluminum construction allows faster pick and place assembly reducing the

manufacturing cycle time.

• Radius mounted “Rollers” are designed for maximizing heat transfer from component and to

avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks.

• Available in bulk packaging or Tape & Reel.

FEATURES AND BENEFITS

TAPE AND REEL INFORMATION

THERMAL RESISTANCE

MECHANICAL DIMENSIONS

219-263A-TR

HEAT SINK FOR TO-263 DEVICES

THERMAL RESISTANCE