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wakefield-vette.com

Contact us: (603) 635-2800

Efficient heat removal at low cost can be achieved by inserting the

286 Series directly into pre-drilled circuit boards;

scored mounting tabs may be bent after insertion to provide added stability. The

286 Series can be wave-soldered

directly to the board. See also 286DB Series on page 55.

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

Height Above

Standard

PC Board

Maximum Footprint

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Material

Convection

Convection

lbs. (grams)

286-AB

1.190 (30.2)

1.000 (25.4) x 0.500 (12.7) Aluminum, Anodized

58°C @ 4W

7.4°CW @ 200 LFM

0.0085 (3.86)

286-CBTE

1.190 (30.2)

1.000 (25.4) x 0.500 (12.7)

Copper, Black

58°C @ 4W

7.4°CW @ 200 LFM

0.0250 (11.34)

286-CTE

1.190 (30.2)

1.000 (25.4) x 0.500 (12.7)

Copper, Tinned

58°C @ 4W

7.4°CW @ 200 LFM

0.0250 (11.34)

Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).

286 SERIES

ALUMINUM AND COPPER LOW-COST WAVE-SOLDERABLE

HEAT SINKS

Thermal Performance at Typical Load

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

287 SERIES

Height Above

Maximum

PC Board

Footprint “A”

Natural

Forced

Weight

Mounting Slot Mounting Hole

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

287-1ABE

287-1ABH

1.180 (30.0)

1.000 (25.4) x 0.500 (12.7)

65°C @ 4W

7.8°CW @ 200 LFM

0.0090 (4.08)

287-2ABE

287-2ABH

1.180 (30.0)

1.000 (25.4) x 1.000 (25.4)

55°C @ 4W

6.4°CW @ 200 LFM

0.0140 (6.35)

Material: Aluminum, Black Anodized

Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned

tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning

of TO-220 and similar semiconductor packages.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

Standard P/NDim. “A”

287-1AB

0.500 (12.7)

287-2AB

1.000 (25.4)

287-1ABH

0.500 (12.7)

287-2ABH

1.000 (25.4)

WAVE-SOLDERABLE LOW-COST HEAT SINKS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

Standard P/N

Thermal Performance at Typical Load

Standard

Nominal Installed

For Use

Weight

P/N

Loading Force

With Series

Material

lbs. (grams)

285 SC

10 lbs

232, 237, 240, 252, 667

Carbon Steel

0.00053 (0.24)

330 SC

4 lbs

232, 237, 240, 252, 667

Stainless Steel

0.00074 (0.34)

SpeedClips™ employ a locking safety tab for mounting. Must be ordered separately for these heat sink series. Use

these SpeedClips™ with our 237, 240, and 252 Series heat sinks for the lowest production assembly time and cost.

Order one SpeedClip™ for each heat sink purchased. Must be purchased with heat sinks.

Speed

Clip

330 SC

4 lb (17.8N)

Nominal Force

Installed

Speed

Clip

285 SC

10 lb (44.5N)

Nominal Force

Installed

285 & 330 SERIES

285 SC AND 330 SC SPEEDCLIPS™

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

695 SERIES

Maximum

Standard

Width

Height

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

695-1B

1.330 (33.8)

0.530 (13.7)

72°C @ 4.0W

5.2°C/W @ 400 LFM

0.008 (4.0)

Mount and effectively heat sink small stud-mounted diodes with the

695 Series space-saving heat sink type. Each

unit is black anodized aluminum with an 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin

design provides good heat dissipation for use where height is limited above the printed circuit board or base plate.

SPACE-SAVING HEAT SINKS FOR SMALL

STUD-MOUNTED DIODES

Thermal Performance at Typical Load

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

TO-220

TO-220

Stud-Mount