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SURFACE MOUNT HEAT SINK

SURFACE MOUNT HEAT SINKS

Footprint

Height Above

Standard

PC Board

Dimensions

Package

Package

Natural

Forced

P/N

in. (mm)

in. (mm)

Format

Quantity

Convection

Convection

217-36CTE6

.360 (9.1)

.600 (15.2) x .740 (18.8)

Bulk

1

55°C @ 1W

16.0°C/W @ 200 LFM

217-36CTTE6

.360 (9.1)

.600 (15.2) x .740 (18.8)

Tube

20

55°C @ 1W

16.0°C/W @ 200 LFM

217-36CTRE6

.360 (9.1)

.600 (15.2) x .740 (18.8)

Tape & Reel

250

55°C @ 1W

16.0°C/W @ 200 LFM

Material: Copper, Matte Tin Plated

Tube: 16.25 Inches Long,

Min. esd Material with

Nail Stops

20 Pieces per Tube

217-36CTT6

217-36CT6

SOL 20

REF: JEDEC TO-263 (DD PAK)

REF: JEDEC MO-169 (DD PAK)

MECHANICAL DIMENSIONS

MECHANICAL DIMENSIONS

TUBE DETAILS

BOARD LAYOUT RECOMMENDATIONS

TAPE DETAILS

217 SERIES

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

SECTION A-A

217-36CT6

KEY:  Device only, NC  Device + HS, NC  Device + HS, 100 lfm



Device + HS, 200 lfm  Device + HS, 300 lfm

MECHANICAL DIMENSIONS

Device Power Dissipation. W

THERMAL PERFORMANCE

6 LAYER BOARD, D’ PAK

125°C LEAD, 40°C AMBIENT

Dimensions: in.

Dimensions: in.

NOTES

1. Material to be “ESD”

2. Approximately 6 Meters per Reel

3. 250 Pieces per Reel.

217-36CTR6

REEL DETAILS

217 SERIES

218 SERIES

Height Above

Maximum

Standard

PC Board

Footprint

P/N

in. (mm)

in. (mm)

Natural Convection

Forced Convection

218-40CTE3

.40 (10.2)

.90 (22.9) x .315 (8.0)

62°C rise @ 2W

21°C/W @ 200LFM

218-40CTE5

.40 (10.2)

1.03 (26.2) x .50 (12.7)

62°C rise @ 2W

21°C/W @ 200LFM

Material: Copper, Matte Tin Plated

218-40CT3

218-40CT5

0

20

40

60

80

100

0200

400600

8001000

AIR VELOCITY (LFM)

0

5

10

15

20

25

0200

400600

8001000

HEAT DISSIPATED (WATTS)

0.5

2.5

2.0

1.5

1.0

0

20

40

60

80

100

0200

400600

8001000

AIR VELOCITY (LFM)

0

5

10

15

20

25

0200

400600

8001000

HEAT DISSIPATED (WATTS)

0.5

2.5

2.0

1.5

1.0

0

20

40

60

80

100

0200

400

600800

1000

AIR VELOCITY (LFM)

0

2

4

6

8

10

0200

400

600800

1000

HEAT DISSIPATED (WATTS)

1

5

4

3

2

0

20

40

60

80

100

0200

400600

8001000

AIR VELOCITY (LFM)

0

2

4

6

8

10

12

14

16

18

20

0200

400600

8001000

HEAT DISSIPATED (WATTS)

1

5

4

3

2

0

20

40

60

80

100

0200

400600

8001000

AIR VELOCITY (LFM)

0

2

4

6

8

10

0200

400600

8001000

HEAT DISSIPATED (WATTS)

2

10

8

6

4

0

20

40

60

80

100

0200

400600

8001000

AIR VELOCITY (LFM)

0

2

4

6

8

10

0200

400600

8001000

HEAT DISSIPATED (WATTS)

2

10

8

6

4

Solid line = 218-40CT5 Dashed Line = 218-40CT3

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

Compatible with surface mount technology (SMT) automated production techniques for ease of assembly

and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in

PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and

improving manufacturers’ component thermal specifications.

SURFACE MOUNT HEAT SINKS

Thermal Performance at Typical Load

Thermal Performance at Typical Load

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

D2PAK; TO-220; SOT-223; SOL-20

SMT Devices

D2PAK; TO-220; SOL-20

• No interface material is needed

• Copper with matte tin plating for improved solderability and assembly

• Both the component and the heat sink are installed on the PC-board utilizing

standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats

• EIA standards and ESD protection are specified

• Can be used with water soluble or no clean SMT solder creams or other pastes

FEATURES AND BENEFITS