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wakefield-vette.com

Contact us: (603) 635-2800

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

CPC1998J PACKAGE

ONE HEAT SINK FOR ALL PACKAGES

System level – 2 screws Natural convection – Vertical

CPC40055ST PACKAGE

Board level – 2 solder pins Natural convection – Vertical Spring Clip

Board level – 2 solder pins Natural convection – Vertical Spring Clip

CPC1968 AND TO-264 PACKAGE

Board level – 2 solder pins Natural convection – Vertical

Spring Clip

L4970A PACKAGE

Board level – 2 solder pins

Natural convection – Vertical

Screw attachment

KBU PACKAGE

Board level – 2 solder pins

Natural convection – Vertical

Spring Clip

TO-247 AND TO-220 PACKAGE

Board level – 2 solder pins

Natural convection – Vertical

Screw attachment or Spring Clip

MOUNTAIN SERIES HEAT SINKS FOR TO-264, TO-247 DEVICES

Wakefield-Vette's

Mountain Series Heat Sinks are high performance, low cost, configurable, scalable and

compact with a matrix clip system for TO220, TO-247, TO-264 and other standard packages. This type

powerful heat sink provides easiest assembly, largest surface areas, smallest space occupation and all-in-

one solution. The power dissipations can be easily increased simply by extending the fin height on each side

of the heat sink, while keeping the heat sink height and PCB layout the same. It is the ideal type of heat sink

for high power density and small size (1U or 2U) electronic packaging with forced convention cooling.

Part Package Attachment Height Off Base Thermal Resistance Material

Number Description Type Cooled Method Length Width (Height of Fin) @ Forced Air Flow Material Finish

MTN-264-27 Heat Sink w/ Two Top Mount TO-247 and Clip and PC Pin

1.06"

1.740"

1.56"

5.5°C/W @ 18 Watts Aluminum

Black

Clips for TO-247

TO-264

(27mm) (44.3mm)

(39.5mm)

Anodized

TO-264

THERMAL RESISTANCE

MECHANICAL DIMENSIONS

• Minimum assembly cost and labor - Spring Clips make

the mounting holes and fasteners obsolete in assembly

operations and reduce costs.

• Maximum Thermal Transfer - Maximum surface area

per unit volume, efficient cooling fins & consistent

mounting force reduces thermal resistance.

FEATURES AND BENEFITS

• Maximum Repeatability - Constant spring force over repeated

assembly/disassembly.

• Maximum Reliability - Resilient spring action locks electronic

component in place. Fewer parts in assembly and no fasteners

and washers required. Prevent short circuit by eliminating metal

particles generated from hardware or thread tapping.

MTN-264-27

SOT-227 PACKAGE