62

63

BOARD LEVEL

HEAT SINKS

BOARD LEVEL

HEAT SINKS

288 SERIES

COMPACT WAVE-SOLDERABLE LOW-COST

HEAT SINKS

Height Above

Maximum

Standard

PC Board

Footprint

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

288-1ABE

1.250 (31.8)

0.875 (22.2) x 0.215 (5.5)

85°C @ 4W

12°C/W @ 200 LFM

0.0057 (2.59)

Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for

vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use

where minimum PC board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized,

designed for applications requiring good heat dissipation from a heat sink occupying minimum space,

available at minimum cost.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

Dimensions: in. (mm)

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

MECHANICAL DIMENSIONS

This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance.

NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types

added to (1) 272-AB type.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

271 SERIES

271 SERIES

TOP-MOUNT BOOSTER HEAT SINKS FOR USE WITH

270/272/280 SERIES

TOP-MOUNT BOOSTER HEAT SINKS FOR USE WITH

270/272/280 SERIES

SMALL FOOTPRINT LOW-COST HEAT SINKS

Height Above

Horizontal Mounting

Standard

PC Board

Maximum Footing

Solderable

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Tab Options

Convection

Convection

lbs. (grams)

270-AB

0.375 (9.4)

1.750 (44.5) x 0.700 (17.8)

—

70°C @ 4W

6.0°C/W @ 400 LFM

0.0052 (2.36)

272-AB

0.375 (9.4)

1.750 (44.5) x 1.450 (36.8)

01,02

42°C @ 4W

3.6°C/W @ 400 LFM

0.0105 (5.72)

280-AB

0.375 (9.4)

1.750 (44.5) x 0.700 (17.8)

—

70°C @ 4W

6.0°C/W @ 400 LFM

0.0048 (2.18)

Material: Aluminum, Black Anodized

These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style

with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used

for double-sided heat dissipation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is

designed for two power semiconductors. Specify solderable tab options for the

272 Series by the addition of

suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

270 SERIES

280 SERIES

272 SERIES

272AB01

272AB02

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

270, 272, &

280 SERIES

Thermal Performance at Typical Load

Horizontal

Height Above

Mounting Footprint

Standard Semiconductor Case

Dimensions

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Convection

Convection

lbs. (grams)

271-AB

0.500 (12.7)

1.750 (44.5) x 0.700 (17.8)

62°C @ 4W (NOTE A)

5.1°C/W @ 400 LFM

0.0052 (2.36)

31 °C @ 4W (NOTE B)

1.8°C/W 400 LFM (NOTE B)

Material: Aluminum, Black Anodized

Thermal Performance at Typical Load

Thermal Performance at Typical Load

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

TO-220

TO-220

TO-220 and TO-202

TO-220 and TO-202