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MPC8541ECVTALF 数据表(PDF) 63 Page - Freescale Semiconductor, Inc |
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MPC8541ECVTALF 数据表(HTML) 63 Page - Freescale Semiconductor, Inc |
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63 / 84 page ![]() MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 63 Clocking 15 Clocking This section describes the PLL configuration of the MPC8541E. Note that the platform clock is identical to the CCB clock. 15.1 Clock Ranges Table 44 provides the clocking specifications for the processor core and Table 45 provides the clocking specifications for the memory bus. Table 44. Processor Core Clocking Specifications Characteristic Maximum Processor Core Frequency Unit Notes 533 MHz 600 MHz 667 MHz 833 MHz 1000 MHz Min Max Min Max Min Max Min Max Min Max e500 core processor frequency 400 533 400 600 400 667 400 833 400 1000 MHz 1, 2, 3 Notes: 1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 15.2, “Platform/System PLL Ratio,” and Section 15.3, “e500 Core PLL Ratio,” for ratio settings. 2.)The minimum e500 core frequency is based on the minimum platform frequency of 200 MHz. 3. 1000 MHz frequency supports only a 1.3 V core. Table 45. Memory Bus Clocking Specifications Characteristic Maximum Processor Core Frequency Unit Notes 533, 600, 667, 883, 1000 MHz Min Max Memory bus frequency 100 166 MHz 1, 2, 3 Notes: 1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 15.2, “Platform/System PLL Ratio,” and Section 15.3, “e500 Core PLL Ratio,” for ratio settings. 2. The memory bus speed is half of the DDR data rate, hence, half of the platform clock frequency. 3. 1000 MHz frequency supports only a 1.3 V core. |
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