MPC8541ECVTALF datasheet(73/84 Pages) FREESCALE

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MPC8541ECVTALF 数据表(PDF) 73 Page - Freescale Semiconductor, Inc

部件名	MPC8541ECVTALF

功能描述	PowerQUICC??III Integrated Communications Processor Hardware Specifications

PDF	84 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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73 / 84 page

MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

The spring mounting should be designed to apply the force only directly above the die. By localizing the

force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to

the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the

opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the

package. Figure 46 and provide exploded views of the plastic fence, heat sink, and spring clip.

Figure 46. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence

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