ST7LITEUSX datasheet(91/108 Pages) STMICROELECTRONICS

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ST7LITEUSx

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13 PACKAGE CHARACTERISTICS

In order to meet environmental requirements, ST

offers these devices in ECOPACK® packages.

These packages have a Lead-free second level in-

terconnect. The category of second Level Inter-

connect is marked on the package and on the in-

ner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to solder-

ing conditions are also marked on the inner box la-

bel.

ECOPACK is an ST trademark. ECOPACK speci-

fications are available at: www.st.com.

13.1 PACKAGE MECHANICAL DATA

Figure 66. 8-Lead Very thin Fine pitch Dual Flat No-Lead Package

Dim.

inches1)

Note 1. Values in inches are converted from mm

and rounded to 3 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.80

0.90

1.00

0.031

0.035

0.039

0.00

0.02

0.05

0.000

0.001

0.002

0.20

0.008

0.25

0.30

0.35

0.010

0.012

0.014

4.50

0.177

3.50

3.65

3.75

0.138

0.144

0.148

3.50

0.138

1.96

2.11

2.21

0.077

0.083

0.087

0.80

0.031

0.30

0.40

0.50

0.012

0.016

0.020

Number of Pins

(D/2 x E/2)

TOP VIEW

SIDE VIEW

BOTTOM VIEW

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