ST7LITEUSX datasheet(93/108 Pages) STMICROELECTRONICS

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ST7LITEUSx

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PACKAGE CHARACTERISTICS (Cont’d)

Figure 69. 16-Pin Plastic Dual In-Line Package, 300-mil Width

Table 21. THERMAL CHARACTERISTICS

Notes:

1. The maximum chip-junction temperature is based on technology characteristics.

2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the

chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application.

Dim.

inches1)

Min

Typ

Max

Min

Typ

Max

5.33

0.210

0.38

0.015

2.92

3.30

4.95 0.115 0.130 0.195

0.36

0.46

0.56 0.014 0.018 0.022

1.14

1.52

1.78 0.045 0.060 0.070

0.76

0.99

1.14 0.030 0.039 0.045

0.20

0.25

0.36 0.008 0.010 0.014

18.67 19.18 19.69 0.735 0.755 0.775

0.13

0.005

2.54

0.100

7.62

7.87

8.26 0.300 0.310 0.325

6.10

6.35

7.11 0.240 0.250 0.280

2.92

3.30

3.81 0.115 0.130 0.150

10.92

0.430

Number of Pins

Note 1. Values in inches are converted from

mm and rounded to 3 decimal digits.

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance

(junction to ambient)

DIP8

°C/W

SO8

130

DFN8 (on 4-layer PCB)

DFN8 (on 2-layer PCB)

106

TJmax

Maximum junction temperature 1)

150

°C

PDmax

Power dissipation 2)

DIP8

300

SO8

180

DFN8 (on 4-layer PCB)

500

DFN8 (on 2-layer PCB)

250

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