ASFC datasheet(4/42 Pages) ALSC

4 / 42 page

Table 1. Ordering Information

Capacities

(GB)

Part Number

eMMC

Version

NAND

Die

Temperature

Package Size

(mm)

Package

Type

ASFC32G31T3-51BIN

5.1

256Gb x 1

Industrial Grade

-40OC ~ 85OC

11.5x13.0x1.0

153ball

FBGA

ASFC64G31T5-51BIN

5.1

512Gb x 1

Industrial Grade

-40OC ~ 85OC

11.5x13.0x1.0

153ball

FBGA

128

ASFC128G32T5-51BIN

5.1

512Gb x 2

Industrial Grade

-40OC ~ 85OC

11.5x13.0x1.0

153ball

FBGA

4.Product Description

The

Alliance e·MMC is a managed non-volatile storage consisting of a single chip MMC controller and a NAND

flash memory chip inside a JEDEC defined standard BGA package. It is specially designed as a small

form factor memory product for storage of data and as a boot media. The performance is optimized

to a mostly read operation mode at low power consumption. The utilization of 3D TLC NAND technology,

with the option to configure the memory in Enhanced mode (pSLC), targets higher demanding

industrial, which is supported by the industrial temperature grade specification.

The e·MMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and

read sensing. The firmware features support high throughput for large data transfers and

performance for small random data more commonly found in code usage. It also contains several security

features as well as multiple boot partitions.

Uses advanced refresh features for retention

optimization for read intensive applications.

e·MMC communication is based on an advanced 11-signal bus. The communication protocol is defined as a

part of the JEDEC e·MMC standard and referred to as the e·MMC mode.

Confidential

-4

／42-

Rev.1.0 July 2023

3. Ordering Information

32GB/64GB/128GB eMMC

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