AM263P4 datasheet(8/168 Pages) TI2

8 / 168 page

Table 4-1. Device Comparison (continued)

FEATURES

REFERENCE

NAME

AM263P4

AM263P4-Q1

AM263P2

AM263P2-Q1

Comparator Modules

CMPSS

12(2) or 20(3)

Digital-to-Analog Converter

DAC

Programmable Real-Time Unit Subsystem(5)

PRU-ICSS

0 or 1

Industrial Communication Subsystem Support(6)

PRU-ICSS

Optional

Gigabit Ethernet Interface

CPSW

Yes (2(8) or 1(9))

Multi-Media Card/Secure Digital Interface

MMCSD

Enhanced High-Resolution Pulse-Width Modulator Module

EHRPWM

16(2) or 32(3)

Enhanced Capture Module

ECAP

8(2) or 16(3)

Enhanced Quadrature Encoder Pulse Module

EQEP

2(2) or 3(3)

Sigma Delta Filter Module

SDFM

1(2) or 2(3)

Fast Serial Interface

FSI

4x FSI_RX + 4x FSI_TX

Octal SPI Flash Interface

OSPI

1 or 0(11)

Flash-in-Package(ZCZ) Variant available

ZCZ_F

Yes

Flash-in-Package density

64Mb or 8MB

Miscellaneous

Junction Temperature

Extended Industrial: –40°C to 125°C

Extended Automotive: –40°C to 150°C(12)

Automotive Qualification

AEC-Q100(7) Option

(1)

Values listed here for DEVICE_ID are bits [31:13] of the TOP_CTRL.EFUSE_JTAG_USERCODE_ID register. For full JTAG ID's please

refer to the Device Part Number Identifier table.

(2)

Standard Analog configuration contains 3x ADC, 16x EHRPWM, 8x eCAP, 2x EQEP, 1x SDFM, 12x CMPSS

(3)

Enhanced Analog configuration contains 5x ADC, 32x EHRPWM, 16x eCAP, 3x EQEP, 2x SDFM, 20x CMPSS

(4)

The 2x Resolver ADC12B3M modules can be used as either Resolver ADCs or general-purpose ADCs

(5)

Programmable Real-Time Unit Subsystem is available when selecting an orderable part number that includes a feature code of D, E, F,

K, L, M, or N. Refer to the Nomenclature Description table for definition of feature codes.

(6)

Industrial Communication Subsystem Support is available when selecting an orderable part number that includes a feature code of D,

E, F, K, L, M, or N. Refer to the Nomenclature Description table for definition of feature codes.

(7)

AEC-Q100 qualification is applicable to select part number variants as indicated by the Automotive Designator (Q1) identifier in the

Nomenclature Description table.

(8)

Applies to devices in the ZCZ-C Package only and have a Special Features code of C. Refer to the Nomenclature Description table for

definition of Special Features codes.

(9)

Applies to devices in the ZCZ-S Package and the ZCZ-F Package that have a Special Features code of F or S. Refer to the

Nomenclature Description table for definition of Special Features codes.

(10) Each R5FSS cluster supports 256KB of Tightly-Coupled Memory (TCM). When configured as Single-Core or Lockstep operating

mode, individual cores can utilize the entire 256KB of TCM memory, while in Dual-Core mode, each core may only utilize its

designated half (128KB TCM).

(11) The Flash-in-Package variant connects the OSPI interface to an OSPI Flash die included in the package, disabling the external OSPI

interface for application use. The flash device in the Flash-in-Package(ZCZ_F) variant does not support RWW(Read While Write) while

performing XIP(eXecute-In-Place) operations.

(12) The Flash-in-Package variant is limited by the OSPI Flash device in the package to 125°C.

AM263P4, AM263P2, AM263P4-Q1, AM263P2-Q1

SPRSP81D – OCTOBER 2023 – REVISED MAY 2025

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